PVC Cardboard Blister Heat Sealing Machine Double-Sided Blister Packaging Sealer

The PVC cardboard blister heat sealing machine, also known as a double-sided blister packaging sealer, is primarily used for high-frequency packaging and sealing of paper cards (base cards) + PVC + paper cards (cover cards). It is suitable for packaging elegant items such as USB drives, LED lights, memory modules, SD cards, and more. Also referred to as a high-frequency blister sealer, high-frequency wave blister sealer, blister packaging sealer, or PVC blister sealer, Lianyu Electromechanical has developed a single-head push-plate high-frequency machine and a three-station rotary high-frequency heat sealing machine to meet the needs of PVC blister packaging. For PVC blister shells, blister paper card sealing, and double-sided blister packaging sealing equipment, the recommended models include the single-head push-plate high-frequency machine, single-head sliding table high-frequency blister sealer, 5KW three-station rotary sealer, and 8KW rotary automatic blister edge pressing machine.

Parameters of the PVC cardboard blister heat sealing machine (double-sided blister packaging sealer):

Model: LY-GP5-k4  LY-GP8-K5  LY-GP4-K2

High-frequency output: 5000W  8000W  2800W/4000W

Power input: 8KVA   13KVA   6.5KVA

Power voltage: AC380V /AC220V/50V

Oscillation frequency: 27.12MHz  40.68MHz

Rectifier: Silicon diode

Pressure application method: Foot pedal or pneumatic, foot pedal

Oscillation tube: 7T85RB(947) 7T69RB (946)  6T51(948)/E3062

Fixed plate size: 350×700/450X850350×700/450X850300X600

Upper and lower electrode spacing: 170  170 /220 150

Mechanical movement distance: 70 70 70

Machine dimensions: 1730×1080×18501780×1080×18501440X1020X1170

Machine weight: 350kg 450 kg 200kg/220kg

Working principle of the PVC cardboard blister heat sealing machine (double-sided blister packaging sealer):

It primarily utilizes high-pressure rectification and self-excited high-frequency electron tube oscillation to instantly generate a high-frequency electromagnetic wave field. Within this field, the internal molecules of the material being processed flow and collide, generating heat. Combined with a certain amount of pressure, this process enables the welding and embossing of the products being processed.